LASER SYSTEMS FOR MICRO MATERIAL PROCESSING We utilize cutting-edge innovations in laser technology to design our highly efficient and reliable processing systems. A dynamic team develops and manufactures laser systems for micro material processing with various applications in the photovoltaic, electronic, and semiconductor industries. The modular platform concept allows the customization of each laser system for the particular manufacturing task, Read more...
As a service provider for protective coatings of electronic assemblies (conformal coating) we work for well-known national and international companies and corporations. In addition to classic conformal coating, we also offer potting and underfilling processes for electronic, as well as electrical insulating powder coatings for electromechanical components. Whether manual piece production or automated series, almost all known coating processes for Read more...
IBL was founded in 1987 and has been working in the soldering sector of electronics since then. IBL recognised the potential of vapour phase technology for assembly and soldering technology at an early stage. They began to develop their own new systems technology for vapour phase soldering during the introduction of SMD- techniques in the manufacture of assemblies. This early Read more...
PCBS Our core business is the development and production of printed circuit boards in a wide variety of shapes and designs. With a high degree of specialization, combined with decades of expertise, we are able to provide PCBs with a wide range of features and adaptations, making them available for a virtually unlimited number of applications and specific environments. Whether Read more...
ED / roll-Cu foils Printed circuit board base material for single, double and multilayer printed circuit boards IMS base material with ALU core for LED / heat management applications Materials for the lamination process Auxiliary materials for drilling, punching, milling Milled parts / finished parts IPC 4101 Read more...
Pick & Place Dispensing Automation The FRITSCH placeALL® is the platform for flexible and cost-effective assembling of electronic components. Our high-precision and universal dispensing machines offer all features for a professional production. Our flexible and standardized machines complete every task in a cost-effective way. Read more...
Sensors and actuators for people and the environment Fraunhofer EMFT conducts applied research on sensors and actuators for people and the environment. The just over 100 employees at the three locations Munich, Oberpfaffenhofen and Regensburg have many years of experience and extensive know-how in microelectronics and microsystems technology. The technology offerings range from semiconductor processes and MEMS technologies through 3D Read more...
Ultrasonic Laser Bonder Leading connection technology for large conductor cross sections in power electronics. Ultrasonic wire bonders Semi-automatic and fully automated connection solutions for sensors, semiconductors and automotive industry. BPC Inside Patented Bond Control System for monitoring and controlling the quality of the bond in the ongoing process. Bond Academy Best Bonder Results through user training, knowledge transfer, advice and Read more...
Component change of SMD and THT components. Manual soldering of SMT + THT components in samples and small batches. Component cleaning to protect against corruption interruption, signal distortion, leakage and electrochemical migration. The cleaning process is adapted to the requirements of the assembly. Gold contacts / gold surfaces of assemblies that have tin spatter or wear can be repaired. Here Read more...
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