F & K DELVOTEC Bondtechnik GmbH

Ultrasonic Laser Bonder
Leading connection technology for large conductor cross sections in power electronics.

Ultrasonic wire bonders
Semi-automatic and fully automated connection solutions for sensors, semiconductors and automotive industry.

BPC Inside
Patented Bond Control System for monitoring and controlling the quality of the bond in the ongoing process.

Bond Academy
Best Bonder Results through user training, knowledge transfer, advice and useful services.