TopLine

TopLine B-52 Cleanliness and Residue Evaluation Test Kit measures ionic and chemical cleanliness of your SMT and throughhole assembly process. Kit follows guidelines of IPC-B-52 test vehicles. Uses ionic and surface insulation resistance (SIR) methods for evaluating electrochemical failures in humid environments. Choice of full version kits that includes PCB, components and connectors. Also available “Economical” version without connectors. Spare Parts are available for customers that provide their own PCB.

Chromatography is the preferred method for determining both type and amount of ionic residue. Reference IPC ion chromatography IPC-TM-650 method 2.3.28. The B-52 boards also provides SIR testing using IPC-TM-650 method 2.6.3.7.

Board consists of four segments:
4″x5.5″ Main SIR test board.
4″x2.6″ Ion Chromatography Coupon
0.55″ Solder Mask Adhesion Strip
0.31″ SIR mini-coupons 2 each

Board Features:

Choice of Final finish:
• Immersion Tin (Sn)
• ENIG (Ni/Au)Gold
• OSP Copper
• Immersion Silver
• HASL SnPb
LPI Solder Mask – PSR-4000BN
FR4 Tg=180°C
Size – 4″x10″ (10×39.4cm)
Thickness 0.062″ (1.6mm)
2-Layer Board
RoHS Compliant
Tooling Holes .125″ (3.17mm)
IPC Fiducials – 0.062″ (1.57mm)

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