Bristol
Pennsylvania
19007
United States
We’ve created a source for electronic component design engineers to download Technical Data Sheets with of variety of interconnect products for Test and Burn-in applications including…
High-Temperature (200°C to 300°C) Burn-in & Test Sockets
ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices
Correct-A-Chip® Product Line of “Intelligent Connectors” Adapters – incorporating Passive and Active Components
BGA, QFN, LGA, QFP, TSSOP, and CSP Test and Burn-In Sockets
High-Frequency (>1GHz) Test Sockets
DIP/SIP Sockets and Headers
Aries Has Mastered These Manufacturing Processes…
Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
Surface-mounting of Electronic Components onto adaptors
Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
Bending Pins (Vertisocket™Line) LED/LCD applications
Installation of Pins into Plastic
Crimping Connectors on Flat Cable
Flat Cable Wire Stripping and Separation
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