Duiven
Gelderland
6921 RW
Netherlands
Welcome to the world of Besi
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.
Company Profile
Besi is engaged in one line of business, the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries.
Customers
Besi’s customers are primarily leading multinational chip manufacturers, assembly subcontractors and electronics and industrial companies. Customers are either independent device manufacturers (IDMs) which purchase Besi’s equipment for internal use at their assembly facilities or assembly subcontractors which purchase Besi’s equipment to produce packages for third parties on a contract basis. Besi’s equipment performs critical functions in customers’ assembly operations and in many cases represents a significant percentage of their installed base of assembly equipment.
Global presence
Besi is a global company with headquarters in Duiven, the Netherlands. It operates seven facilities in Asia and Europe for production and development activities, as well as eight sales and service offices across Europe, Asia and North America. End 2017 Besi employed a total staff of 2,040 fixed and temporary personnel of whom approximately 71% were based in Asia and 29% were based in Europe and North America.
Stock market listings
Besi was incorporated under the laws of the Netherlands in May 1995 and had an initial public offering in December 1995. Besi’s Ordinary Shares are listed on Euronext Amsterdam (symbol: BESI) and are included in the Amsterdam Midcap Index. Besi’s level 1 ADRs trade on the OTC markets (symbol: BESIY Nasdaq International Designation).
Our services
Products & Services
Besi develops and supplies leading edge systems offering high levels of accuracy, reliability and productivity at a low cost of ownership. Besi offers customers a broad portfolio of systems which address substantially all the assembly process steps involved in leadframe, substrate and wafer level packaging. Besi’s principal product and service offerings include:
Die Attach Equipment
Besi produces single chip, multi chip, multi module and flip chip, TCB and eWLB die bonding systems and die sorting systems.
Packaging Equipment
Besi produces conventional, ultra thin and wafer level molding, trim & form and singulation systems.
Plating Equipment
Besi produces tin, copper and precious metal plating systems and related process chemicals.
Service
Besi provides tooling, conversion kits and spare parts and other services for its installed base of customers worldwide.
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Our product groups
Plating equipment
Molding
Mold presses
Molding tools
Cutting/punching presses
Cutting/punching tools
Dispensing machines
3D assembly equipment
Bonding
Diebonder
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