Pyeongtaek-si
Gyeonggi-do
Korea, South
About LB Semicon Welcome to LB Semicon, the company with the world’s best technology.
World No.1 Total Package Company
World No.1 Wafer Bumping through Probe Test & Back-end Solution Provider
LB Semicon Inc. was launched in February 2000 and was the first company in Korea to start business in the flip-chip wafer bumping field with all necessary production facilities established.
Starting with gold bumping for TFT LCD & OLED Display Driver IC (DDI), LB Semicon Inc. has expanded its scope into Solder bumping,
Cu pillar bumping, and even Wafer Level Chip Scale Package (WLCSP) by continuously developing its flip-chip bumping technology. Based on such technological process, the company has maintained solid partnerships with top semiconductor chip manufacturers both at home and abroad.
As semiconductor chip manufacturers seek to produce increasingly lighter and thinner products, wafer bumping technology is expanding its application scope and creating more value. In order to keep up with this trend, LB Semicon Inc. is deeply committed to continuous research and development, and is steadily advancing towards the goal of becoming the “World No.1 Total Package Company.”
WLCSP(WLP)
Wafer-level Packaging (WLCSP) is the technology of packaging and testing an integrated circuit while at the wafer level and then slicing it into chips to make the completed product, which differs from the conventional method of slicing the processed wafer first into individual chips and then packaging them. WLCSP is a true chip-scale packaging technology.
Demand for WLCSP is increasing rapidly in the mobile market, due to the realization of a true chip-scale package with excellent electrical properties and price competitiveness. The WLCSP continues to expand its scope of application.
LB Semicon currently provides various layers of WLCSP solutions ranging from two layers to six layers tailored to meet the needs of our customers.
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