The Hesse GmbH was founded in 1986, HauptHesse new buildingThe seat of the company is Paderborn. Main field of activity of the Hesse GmbH is the development, production and marketing of fully automatic machines for the assembly and connection technology (AVT) in connection with standardized or product-specific automation solutions.
Hesse GmbH is one of the world’s leading manufacturers of fully automatic wedge-wedge bonders, software systems for monitoring ultrasonic bonding processes, ultrasonic flip-chip bonders and customized tools
and machines.Wire bonder production
The relevant industrial companies of AVT (semiconductor manufacturers, HF / RF, automotive, medical, etc.) belong to the worldwide customer base of Hesse GmbH. On-site customer care, especially in the key Asian and American markets, is ensured through subsidiaries in Hong Kong, the US and Japan, with dedicated sales and service. In addition, there are cooperations with partner companies in more than 30 countries.
Core competencies of the company are mechatronic systems, ultrasonic technology and control engineering and in particular the detailed knowledge of the processes and physical effects in ultrasonic connection technology. In order to maintain or expand technological leadership, intensive work and research are carried out in all of the aforementioned fields of work. There are international cooperations with universities and research institutes. Development goals include simple designs with high integrated functionality and freedom from wear, as well as the integration of intelligent systems to achieve error-free processes, such as the patented process-integrated quality monitoring system PiQC, which records and evaluates relevant quality parameters in real time.
Current series machines:
Bondjet BJ653: Bonder for manual or automatic bonding (wedge-wedge and ball-wedge)
Bondjet BJ820: Fully Automatic Thin Wire Wedge Wedge Bonder for 12.5 – 75 μm (Al, Au, Cu)
Bondjet BJ855: Fully Automatic High Speed Thin Wire Bonder
(Wedge Wedge and Ball Wedge)
Bondjet BJ931: fully automatic double head wedge wedge bonder for thick wire, thin wire and ribbon (Al, AlCu, Cu)
Bondjet BJ935 / 939-BJ955 / 959: fully automatic thick wire Wedge Wedge Bonder for thick wire and ribbon (Al, AlCu, Cu)
Bondjet BJ980: fully automatic heavy wire Wedge Wedge Bonder especially for large format substrates for processing solar and battery modules
Bondjet BJ985: fully automatic heavy wire wedge bonder with a large working range
Process support, development and consulting:
We support you in the development and implementation of individual process requirements (eg pattern bonding, prototype production, design validation, small batch production, module production, process optimization).
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