HUBERT HEUSNER Industrievertretungen und Handel

HHI Industrievertretungen Your partner for expert advice in the area of ​​printed circuit board manufacturing. With our products, you can successfully perform the manufacturing processes of stencil printing, SMT placement, vapor phase reflow soldering, vacuum soldering, selective soldering, single point soldering, and robotic soldering. New is our dosing technology Here, the jetting of solder paste offers you new possibilities.

The dosing systems or dosing systems from Musashi will help you further where you have the greatest difficulties. We can show you numerous patented and innovative dosing systems and show you how your application can be realized.

Automatic or robotic bulb-light-laser-induction and flame-soldering systems can solder your special solder joints on the PCB, in the housing and MID from above, below and vertically. Foil conductors, flex conductors and flex circuits made of different materials can be reliably soldered using our processes.

Ceramic substrates and metal substrates for power and RF applications are realized. Hybrid circuits on ceramic or stainless steel substrates for the most diverse applications are developed by us and manufactured cost-effectively.

dcb Substrates or dbc substrates for power electronics Applications are also etched by us in small quantities for you, laser engraved or singulated by laser. Thick-film substrates on AL²O³, AIN, stainless steel and titanium substrates are manufactured for your pressure sensors and flow sensors from batch size 10 pieces.

Sputter targets in all shapes and materials as well as evaporation materials for your coating system are delivered to you in the highest quality and at low cost.

Ships for your evaporation plant are supplied in different materials and shapes.