PacTech - Packaging Technologies GmbH

EQUIPMENT
PacTech is a leading supplier of Advanced Packaging Equipment with more than twenty years of engineering experience. Our state-of-the-art automated equipment meets high quality standards and is suitable for various applications.

WLP SERVICES
PacTech is a worldwide leader in Wafer Level Bumping & Packaging Services. These services meet the high quality demands of our customers and support both engineering and prototyping services as well as high volume production.

CHEMISTRY
In cooperation with our partners we develop high-tech-chemicals for applications which are adapted to our processes. Our product portfolio includes concentrates and baths ready to use.

Pac Tech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality.