Solder paste templates are used to apply solder deposits on the circuit board. Subsequently, the SMD components are placed in the solder depots and soldered in a subsequent reflow soldering process.
Solder paste stencils can be made according to customer requirement as bare foils, stencils with edge perforations or glued in the frame.
For stencil production we use a spring-hard stainless steel foil.
Thicknesses between 75μm and 200μm are usually used for solder paste printing.
To label the templates, the text is cut through in the standard.
For the production of a template, the required customer data can be provided in the following data formats:
Gerber data, as well as associated aperture list
Extended Gerber data
Barco DPF data
DXF data
ODB ++ data
Other data formats on request
The specification of the squeegee side is absolutely necessary, because if the information is missing, the page-correct production of the template is not ensured.
Extensive pad processing as well as reduction or enlargement of pads is possible.
Span templates:
These templates are provided according to the tenter used with an edge perforation. For handling reasons, edge reinforcement is recommended for stencils with a thickness of 180μm.
Pasted templates:
In the glued stencils a template is held by means of metal mesh under the required tension in the frame.
