Namics Europe GmbH

Chipcoat
Chip-on-Film Underfill (COF)
Flip Chip Underfill (UF)
Dam-and-Fill Encapsulant
CSP/BGA Board Level Underfill (SUF)
B-stage Adhesives
Camera module adhesive
Die Attach Adhesive (Chipcoat)
Low-temperature Curable Adhesives
Pre-applied non-conductive underfill paste (NCP)

Unimec
Electromagnetic Interference (EMI) Shielding Paste
High thermal conductivity paste (Low modulus, High reliability)
Air-curable Conductive Copper Paste
Stretchable Conductive Pastes
Surface Mounting Adhesives
Pastes for Terminal Electrodes of Passive Components (Unimec)
Flip Chip Adhesive (SBB)
Die Attach Adhesives (Unimec)
Pastes for Electrodes on the Back/Front of Solar Cells (Unimec)
Low-temperature sintered high thermally conductive die attach pastes using MO technology