Silicon Forest Electronics, Inc

Automated Assembly
Surface Mount Technology, including BGA and micro-BGA placements
Convection and Vapor Phase Reflow
Selective Soldering
High mix, low rate prototyping and production
Manual Assembly
Through-Hole Technology
Press-Fit Assembly
Box Build Integration
Specialty Processes
Conformal Coating
Flex and Rigid-Flex Assembly
Lead and Lead-Free (RoHS) Capabilities
Fine Pitch Component Placement
2D & 3D AOI and Xray
Vibration Testing
BGA Underfill