Altus-PCB

PCBs with Embedded Copper Coin See what the heat is all about !!
In today’s power hungry applications the bare board is taking a more active role in dissipating heat from components directly through the PCB to a heat sink.

Dissipating heat through a PCB can be done with thermal vias or MCPCB ( Metal core PCB) but sometimes thermal vias are not sufficient and MCPCB is not an option due to layer count. That is where press fit Copper Coin can be the answer.

The concept is based on getting a copper coin press fit into a premade cutout in the board right under an area that is identified as a hot spot – MOSFET pad for example.

The copper coin can be pressed all the way up to layer 1 and act as the assembly pad and provide the ultimate heat transfer channel for a hot component. In other cases if the pad size is too small and there are routing considerations under a hot pad, the copper coin can be pressed fit only up to a designated layer and not through the whole PCB.
Stack up configurations