Alltemated, Inc.

Since 1993, Alltemated has been a leader in the Value-Add service industry. We are an ISO 9001:2008 registered company. Alltemated employs the most efficient and effective methods for services such as IC Programming, Carrier Tape Manufacturing, Tape and Reel and other Assembly Services. Our patented manufactured underfill alternative solution, PLACE-N-BONDTM Underfilm, sets us apart in the market.

PLACE-N-BONDTM Underfilm
This patented Underfilm technology uses pre-formed thermoplastic to edge-bond BGA/CSP/LGA and other packages to the PCB. This helps to improve solder ball/joint and shock-drop reliability without the need to dispense from a syringe like traditional underfill. PLACE-N-BONDTM Underfilm comes packaged in Tape and Reel and can be seamlessly integrated on existing SMT assembly lines, where the Underfilm strips can be picked and placed with a custom nozzle.