Melbourne
Florida
32904
United States
GEIA-0006 COMPLIANT AUTOMATED TINNING SERVICES
SemiPack’s fully automated tinning services restore the finish of leads for both through-hole and surface mount devices. We tin components for a wide variety of applications and adhere to military specifications, including the Government Electronics and Information Technology Association (GEIA) specifications.
TRIM & FORM FOR CIRCUIT BOARDS & SEMICONDUCTORS
SemiPack has a wide variety of trim and form tooling, including tooling for fine pitch devices. We offer trim and form processes for through-hole devices with both axial and radial lead. Our capabilities range from fully automatic to manual processing; cropping and forming; and lead forming to meet clients’ exact specifications.
TAPE & REEL FOR SURFACE MOUNT, RADIAL & AXIAL PACKAGING
SemiPack provides rapid and flexible taping per industry standards. Our tape and reel operations support a wide variety of standard surface mount, radial, and custom component package types. SemiPack’s key advantage is an inventory of over 4,000 pockets, including hard-to-find component pockets.
BGA COMPONENT REBALLING & CIRCUIT BOARD REWORK
SemiPack offers BGA reballing services and BGA restoration services with speed, reliability, and affordability that is unrivaled in the electronics manufacturing industry. SemiPack provides electronics manufacturers with a single source to meet reball project demands while reaching the highest quality of standards.
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