PCB IPC SMT EMS SEMICONDUCTOR NEWS
Global SMT & Packaging – The Global Assembly Journal for SMT & Advanced Packaging Professionals enters it’s 19th year providing the latest printed circuit board technology and electronics manufacturing news, process tips and smt industry news to professionals in the surface mount and semiconductor advanced packaging industry news. Global SMT & Packaging is the world’s leading B2B magazine for electronics assembly and advanced packaging professionals with editions in US, and China. With two editions (Internationaland China) and four websites (International; China; Southeast Asia; Germany/Austria/Switzerland). These sources offer solution-led technical articles, business forecasts, insightful columns, coverage of industry news, new products and events.
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