Nordson Test & Inspection

About us

Nordson DAGE, MATRIX, SONOSCAN and YESTECH are part of the Advanced Technology Electronics Systems Group of the Nordson Corporation (NASDAQ: NDSN) and manufacture and support a complete range of Industry leading Test and Inspection equipment. We offer an award-winning portfolio of Acoustic Micro Imaging, Automated Optical Inspection, Automated X-ray Inspection, Manual X-ray Inspection, Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems to bring powerful cost-effective solutions to the Printed Circuit Board Assembly and Semiconductor industries. Nordson continues to invest significantly in research and development to remain at the cutting edge of technology.

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Our services
The 4600 Automated Bondtester is designed to give the most accurate and reproducible test results, ensuring maximum data integrity. For the most complex devices with a high density of bumps or very fine pitch wires, automation is the only way to ensure maximum test accuracy. The high precision system is capable of testing <50µm interconnects by using the latest camera assisted automation routines. The Nordson DAGE 4600 Automated Bondtester is designed to give the most accurate and reproducible test results, ensuring maximum data integrity. For the most complex devices with a high density of bumps or very fine pitch wires, automation is the only way to ensure maximum test accuracy. The high precision system is capable of testing <50µm interconnects by using the latest camera assisted automation routines. Nordson DAGE’s Quadra® Series X-ray inspection takes you beyond optical imaging, allowing you to non-destructively inspect obscured areas inside devices and components at up to 68,000 times magnification. The Quadra®7 represents the cutting edge of X-ray inspection performance, allowing features as small as 0.1µm to be resolved. Ultra-high quality 6.7megapixel images are displayed at full one-to-one resolution on two 4K ultra high definition monitors. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology inspects solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The Nordson MATRIX X-series is market leading high-speed inline systems for automated X-ray inspection dedicated for the SMT process. The X-series facelift 2019 features improved part handling capability, faster image acquisition performance and a higher resolution flat panel detector in comparison to the previous generation AXI system. The platform combines transmissional, oblique and 3D inspection methods, thus provides a flexible, targeted and optimized approach to inspecting solder joints with minimal cycle time and maximal defect coverage. The Gen6™ C-Mode Scanning Acoustic Microscope from Nordson SONOSCAN has the most comprehensive range of analytical capabilities, accuracy and resolution perfect for a variety of applications, such as Microelectronics, MEMS, SSL LEDs, Power Modules, Solar technology and panels and advanced materials. The Gen6 includes SonoSimulator™ to simplify the analysis of devices with multiple thin layers. Advanced Sonoscan capabilities such as PolyGate™, Virtual Rescanning Mode (VRM™) and available Frequency Domain Imaging (FDI™) add value and confidence to the data. Show less Our product groups Automatic optical inspection (AOI) PCB inspection systems Component test equipment Assembly test equipment X-ray inspection Computer tomography Automatic X-ray inspection Manual X-ray inspection Acustic microscopes Bonding testers