FUJIFILM Electronic Materials Korea Co., Ltd.

Polyimides and PBO’s

Polyimide and Polybenzoxazole products are specialty stress relief coatings used as a protective layer or “buffer coat” before packaging or redistribution layer.

Buffer coat layers provide protection to finished die during back grind, singulation and assembly processing resulting in improved packaged yields and increased reliability lifetime performance. Redistribution layer applications enable the most advanced packaging designs.

Photosensitive – Aqueous Developable

PBO based products designed and optimized for buffer coat and redistribution layers

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Photosensitive – Solvent Developable

Designed for thick film capability, robust processing and with excellent mechanical properties

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Non-photosensitive

Materials for low shrinkage, low temperature and lift off applications