Korea Circuit Co., Ltd.

Product descriptions
Create The New Value as Global Business Thanks to Customer’s support, we do accomplish the bright future
HDI (High Density Interconnection)
HDI (High Density Interconnection)
The main board features fine patterning and highly integrated technology including Micro via, and improves the functions of electronic devices by being embedded in smart phones and tablet PCs.

Package Substrate
This is a main substrate that helps memory chips delivering electronic signals to function well between the memory and the main board. It has fine patterning, and is mostly applied to networking devices, including smart phones, PCs and tablet PCs.

Rigid-flex
This multi-player substrate combines flexible PCB and rigid PCB, and is applied to smart devices requiring high-speed signal transmissions.