PRODUCTION and INSTALLATION of PCB: Technological capabilities: Board type: single-sided (OPP), double-sided (DPP), Multilayer (WFP), microstrip, LTCC boards. Number of layers: 18 Materials used: FR-4, Rogers, STF, etc. Foil thickness: 18.35.50 microns Minimum width of conductor / minimum gap: 0.12 / 0.12 mm Minimum diameter of a through hole metallized: 0.2 mm. Coating: pic -63 (HAL), immersion tin, immersion gold. Coating of knife connectors: gold-cobalt, nickel, gold. Quality standards: GOST 23752, GOST 23751, IPC-A-60. Military acceptance. Types of work performed:
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