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Our areas of expertise SMD assembly THT assembly Selective and wave soldering Production of complete assemblies with functional testing Terminal manufacturing, assembly and wiring Sample, small and large series production Cable assembly Complete material procurement and warehousing Assembly coating Close cooperation with development offices Handling after-sales service for our customers Read more...

today we are: A very experienced development and manufacturing company in the field of RFID transponder technology, pressure measurement and sports watch development. Open to new technologies, coupled with extensive know-how, 30 years of experience and close cooperation with our customers – this is how we can help you to realize your project. Read more...

Based in Munich, Germany, with offices in Tokyo, Japan, and San Francisco, California, GenISys develops, markets and supports flexible, high-performance software solutions for the optimization of microstructure fabrication processes. Addressing the market for lithography and inspection, GenISys combines deep technical expertise in layout data processing, process modeling, correction and optimization with world class software engineering and a focus on ease Read more...

Based in Munich, Germany, with offices in Tokyo, Japan, and San Francisco, California, GenISys develops, markets and supports flexible, high-performance software solutions for the optimization of microstructure fabrication processes. Addressing the market for lithography and inspection, GenISys combines deep technical expertise in layout data processing, process modeling, correction and optimization with world class software engineering and a focus on ease Read more...

Based in Munich, Germany, with offices in Tokyo, Japan, and San Francisco, California, GenISys develops, markets and supports flexible, high-performance software solutions for the optimization of microstructure fabrication processes. Addressing the market for lithography and inspection, GenISys combines deep technical expertise in layout data processing, process modeling, correction and optimization with world class software engineering and a focus on ease Read more...

Specialties Maskless Aligners, Laser Lithography Systems, Direct Write Lithography, Grayscale Lithograpy, Thermal Scanning Probe Lithography, Two-Photon Polymerization, 3D Laser Lithography, 3D Additive Manufacturing, Advanced Packaging Solutions, Nanopatterning, Microfabrication, Nanofabrication, Microfluidics, Nanofluidics, Photomask fabrication, MEMS, Biomedical Engineering, Maskless Laser Lithography, Semiconductors, and Micro-Optics Read more...

Specialties Microtechnology, Microsystems, Optoelectronics, Wafer Back End Services, Miniaturization, Packaging Services, and Assembly and packaging of integrated circuits AEMtec is one of the global acting specialists for the development and production of a variety of precision optoelectronic products like components, subsystems, modules and complete systems. With our wide technology portfolio including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Read more...

Specialties Microtechnology, Microsystems, Optoelectronics, Wafer Back End Services, Miniaturization, Packaging Services, and Assembly and packaging of integrated circuits AEMtec is one of the global acting specialists for the development and production of a variety of precision optoelectronic products like components, subsystems, modules and complete systems. With our wide technology portfolio including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Read more...

Die ADEC GmbH verfügt über langjährige nachhaltige Erfahrungen in der Bestückung und Entwicklung von Leiterplatten. Unser qualifiziertes Team produziert für Sie Gehäuse in 0201-Bauform bis hin zur Bestückung von BGA-Bauformen mit unseren MYDATA Bestückungsmaschinen. ADEC SMD-BestückungADEC SMD-BestückungADEC SMD-BestückungADEC SMD-BestückungADEC SMD-BestückungADEC SMD-BestückungADEC SMD-BestückungADEC SMD-BestückungADEC SMD-Bestückung Zu BGA´s Eine ganze Palette unterschiedlichster Gehäusetypen auf der Basis der BGA- (Ball Grid Array-)Verbindungstechnologie bietet Read more...