Demak S.r.l.

DEMAK offers you a complete process, starting from the choice of the best resin to the most suitable system “The quality requirements for electronic components are always higher and therefore also the quality of the machines for dosing of resins must continuously increase. must be specially developed to optimize the process to be performed with the dosing machines, the plants must work more and more precisely, being at the same time extremely high performance, fast and reliable both for standard production and for mass production.it is a process used to fill a mechanical or electronic assembly completely with thermosetting bicomponent epoxy resins, polyurethanes, poly-butadienes, modified silicone resins. Usually the resin or other product is dosed in a plastic box or in a metal container, where the electronic unit is placed. L ‘ Encapsulation instead is a process that provides a mold or a frame around an object, eg. wires, filling the space between the frame and the object with a polyurethane, an epoxy resin or silicone. The mold is usually removed after polymerization of the resin. These processes are commonly used in order to:

Protect from mechanical damage, vibration and shock resistance
Protect the design of products such as printed circuit boards (PCBs)
Improve the thermal dissipation that allows to place the parts much closer together, so that the product can be smaller
Get structural reinforcement
Increase mechanical stability
Electrical insulation
Improve fire resistance (UL 94)
In a nutshell, resins increase the durability and functionality of parts.

Electric components potting and encapsulating
Continuous miniaturization means continuous research and update.

Everlasting LED technology
Discover the latest application in the science of light protection