Cavenago di Brianza
Lombardia
20873
Italy
Condura®+ Alumina substrate with pre-applied solder
Pre-applied systems simplify processes, decrease investments, improve production yield and reduce production risks. The new Heraeus pre-applied solder Condura®+ customized material system fulfills those targets while saving time and money during the die attachment manufacturing process.
DCB+ alumina substrates with pre-applied solder
In the electronics market the simplification of processes is crucial for higher yield with lower costs and minimized risks. In order to support these key targets, Heraeus offers pre-soldered Condura®+ alumina substrates for die attachment.
This new material system combines Heraeus’ premium metal ceramic substrate with flux-free solder pads that have already been pre-applied. This simplifies the die soldering process dramatically since solder paste printing and flux residue cleaning are not required. Furthermore, since the solder material is just a metallic alloy and does not contain any solvent, solder splattering is avoided.
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