Roshini Microsystems

PCB DESIGN
Design up to 18 layers (Multi-layer design)
Design of Analog / Digital PCBs
Commercial or Military

Design of critical RF boards

Design of Differential signals and High speed clock signals

Signal Integrity Management

EMC & Thermal Analysis

Impedance management

Schematic Capture Net List, Part List

Output in all forma

Documentation ( Bill of Material, CAM Outputs, DXF and Gerber Data )

For most companies, board size, layer stack-up, component type, placement and routing is extremely critical. All the current surface mount technology (SMT) design and fabrication techniques available today can be utilized. Data line is heavily experienced in ultra hi-density single and double-sided component placement optimization of very fine to ultra fine pin pitched parts. Complex manual routing and auto-routing techniques. Mother-daughter board stacking utilizing both rigid and flex circuit interconnection. Fine-line traces/spaces, mini-vias, imbedded vias, shielded fast clock routes, fixed matched pairs, complex analog/digital multi-split VCC/GND planes, .040 dia, .100 spaced IC test point placement. After compiling your supplied net-list we pre-set the layout design rules before routing or placement of components begin. Design Rules Checking ( DRC) continually checks for both continuity and artwork opens and shorts. We can create complex, custom board outlines with many curves, slots, cut outs and angles. We can import directly into our PADS CAD system your mechanical .DXF file, to show fixed component locations, height restrictions, route/component keep-outs, tooling and board outline, Etc. Meticulous attention is given to all aspects of the design, including the often neglected silkscreen, solder mask and solder paste stencil. To simplify locating components during prototype de-bugging, we can re-sequence the component labels on the silkscreen. A back annotation file is supplied here to automatically back-annotate your CAD schematic

PCB FABRICATION
single side board

Multi-layer PCBs up to 42 layers

Buried vias

Blind vias

Thermal clad

Gold plating

Flexible multi-layered PCBs

Inner layers Copper thickness ranging from 35 microns to 120 microns

PCB ASSEMBLING SERVICES
Thru Hole & Surface Mount Assembly

Kitted or Turn-Key

High Temp Solder SN96 *Large Boards up to 25

Engineering Prototypes Available in 24-48 Hours

Small, Medium, to Large Production Quantities

Quick Turn & Standard Deliveries Available