TEPROSA GmbH

3D-MID TECHNOLOGY
3D-MID stands for Molded Interconnected Device . The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. In addition to more freedom in design, cost advantages and a higher functional density are possible advantages of this technology over conventional methods. As a full-line supplier, TEPROSA offers you services for every single process step along the 3D-MID production chain .

Here is a brief overview of our options:
Services offered as PDF: 3D-MID service overview TEPROSA GmbH
PROJECT & SUPPLIER MANAGEMENT
As a developer and service provider, TEPROSA offers you everything from one source. From the first draft through the creation of a prototype to serial production, we take over at your request the entire project and supplier management of the 3D-MID production chain.