Products Systems
Posted on January 23, 2015By tmcgmbh
Reflow soldering systems
Powerful technology for the laboratory and small series
With the microprocessor-controlled MRO 160 and MRO 250 systems, we meet the needs of customers looking for a simple, compact and cost-effective solution for reflow soldering of SMD-equipped PCBs and curing adhesives.
The systems are optimally suited for small series, laboratories and development areas. They provide space for assemblies up to a size of 200 x 160 mm (MRO 160) and 350 x 250 mm (MRO 250). The transport of the printed circuit boards into the process chamber is carried out by a servo-driven loading drawer, which is also automatically moved out of the process area after the soldering process has ended.
Both systems are characterized by a uniform temperature distribution over the entire PCB surface as well as the avoidance of temperature shadows and overheating. This is ensured by an energy transfer to the module by means of convection.
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Excellence all along the line:
Simple : programming and operation are carried out via a menu-driven user interface and an LCD display.
Fast: After switching on, the system is immediately ready to enter a specific temperature profile.
Reliable: A microcontroller controls the heating process and guarantees reliable and reproducible results.
Transparent: Any soldering or curing process can be observed through the viewing window.
Flexible: The reflow soldering systems MRO 160 and MRO 250 can be used for single-sided and double-sided SMD modules.
