LaserMicronics GmbH

Process development
From planning to production.

Laser plastic welding
Contactless laser welding process.

Laser cutting
Precise work with the UV laser.

Microvia drilling
Production of microvia holes with a diameter of less than 200 μm. Micromachining ceramics Cutting, drilling, scoring and engraving of ceramics.

Solder masks and masking films
Laser processing of the most demanding solder masks in the HDI range <50 μm. Repair & reworking Remove solder resists and masking films and reduce scrap circuit boards. TCO / ITO laser processing Laser cutting of the finest insulation in the invisible TCO layer. Cutting micro parts High-precision cutting parts with a thickness of up to 2 mm are cut from sheet metal.