MIE Multiline International Europa GmbH

Mie offers sensible upgrades to Multiline Technology machines to bring peace of mind and many more years of accurate and reliable production.
As many in the PCB Fabrication industry have experienced, Multiline Technology, the leader in the world in Multilayer Registration solutions, found it impossible to continue its business activities and has closed its doors for the last time as of June of 2016.

The company started as Lenkeit Industries in the 1940s as a Tool and Die making business serving the Electrical and Automobile industries. Alfred Angelo became a partner in the 1950s and became the sole owner in the 1970s. In the mid-1970s Alfred’s older son, Michael joined the company and started to steer the company toward specialized tooling for the piercing and blanking of single-sided and punched-plated through Printed Circuits. When multi-layer printed circuits began becoming wide-spread in the late 1970s largely because of the growth of the mini-computer industry, Lenkeit was well positioned to supply Registration-slot punching dies to PCB fabricators in the United States and particularly to the burgeoning computer industry which at that time centered mostly in New England.

Paul Waldner was hired in 1980 to design a line of equipment including the Acculine Laminate Punch, the Optiline Artwork punch, the Pre-preg Punch, the Depinner, the Layup Table and ultimately the Post Etch Punch. Multiline Technology was started as a division of Lenkeit Industries in 1981. In 1985, Lenkeit Industries no longer did business as Lenkeit Industries and all its Tool and Die making business was abandoned and the remaining Lenkeit employees were integrated into Multiline Technology. Exports became an important part of Multiline’s business in the mid 1980s. Paul Waldner moved, along with his family, to Germany in 1987 in order to establish Multiline International Europe (mie).

Mie expanded its business beyond the narrow focus of Registration Systems although mie and Paul Waldner continued Multiline’s tradition of innovation and was a source of Product ideas, Product Development and Product improvement to Multiline Technology throughout mie’s history. From 1991 to 2015 Multiline Technology and Paul Waldner were partners in Multiline International Europe. During that time mie became an important contributor to the state-of-the-art of Imaging and Exposure Technology, Laser Drilling, X-Ray Registration Drilling, Registration of Exposure and Multilayer panels and Multilayer Pressing technology. Multiline International Europa and Multiline Technology and by extension, Michael Angelo and Paul Waldner, stopped their partnership relationship in 2015. Multiline Technology ceased doing business in 2016, but Multiline International Europe (mie) remains active, robust and very much still in business.

Today mie is the distributor throughout Europe, the Middle East and Africa (EMEA) for Fujifilm’s PCB products. Mie continues to offer Registration solutions to our customers including Post Etch Punching, X-Ray Drilling, Exposure Frames, Film Punching and Inductive Bonding Systems (with the Indubond system of Chemplate). In addition Multiline International Europa has supply or cooperation agreements with:

• Innolas, a German producer of Laser micro-machining and drilling machines;

• Miva Technologies, a German producer of Laser Imaging Solutions;

• Entelechy, an Engineering Out-sourcing Service and

• eSurface, offering solutions for Fully Additive and Semi-Additive Circuit Technology

Many Multiline Technology customers in the world today are worried about how they will be able to maintain their machines into the future. Mie is offering reasonably priced up-grades of obsolete or unsupported elements of Multiline Technology machines. Mie commits to find solutions to all the problems of maintaining older Multiline Technology machines both electrically and mechanically.