Zollner zandt

electronics
The Zollner service portfolio in assembly production and testing includes all technology combinations including product-specific special processes.

We offer our customers all processes in lead-free (RoHS-compliant) technology or, on customer request, also in conventional execution.

Design analyzes according to customer specifications using the Zollner Design Guidelines
DFM analysis (Design for Manufacturing)
DFT analysis (Design for Testability)
DFA analysis (Design for Assembly)
DFR analysis (Design for Repair)
Material traceability at installation location level, process and test data traceability
Production according to international standards, e.g. B. J-STD-001 / IPC
Clean room / clean room production ISO 9 according to ISO 14644-1
SMT manufacturing
Stencil printing (solder paste, glue), e.g. B. coated, stepped stencils
Inline SPI (3D paste inspection)
Dispensing technology
Placement machines, the latest technology, placement 01005 as well as all types that can be fitted with pick & place technology
Reflow soldering in a protective gas atmosphere (with and without vacuum)
Vapor phase soldering (with and without vacuum)
Pin-in-paste technology
Underfill for FC, BGA, LGA
PoP assembly (Package on Package)
THT manufacturing
Automatic / manual placement
product-specific special assemblers
THT soldering using wave, point wave, stroke-immersion soldering processes in a protective gas atmosphere
Robot soldering
Induction soldering
Laser soldering
Press-fit technology with force-displacement monitoring
Depaneling technology (routes, lasers, punching)
Assembly cleaning (ultrasound, pressure flooding, spray process)
Module protection
Conformal coating (partial coating, nano-lacquer, milli-coat process, dip coating, certonal coating, parylene coating)
Potting (resin, silicone, hotmelt, melt resin)
Optical and X-ray inspection methods
Inline AOI for SMT
Inline AOI for THT
Inline AXI
Inline combination systems AOXI (Automatic optical X-ray inspection)