Future Packaging Fertigungslinie und Gemeinschaftsstand

About us

Challenges! All around us! In all media and on all channels. We are constantly required to face up to various challenges. Buzzwords fly around your ears with such regularity that you can quickly lose your bearings. Yet in the area of manufacturing in particular, the requirements have basically been the same since the beginning of the industrial age. The aim is to manufacture flawlessly, resource-sparingly, and energy-efficiently and to achieve a high level of quality and intrinsic value. Later, in order to improve quality along the value creation chain, there was also a demand for complete documentation of the most important indicators.

The almost 30 line participants and co-exhibitors of the production line and the Future Packing joint booth will present ways, options, and, above all, the latest machines and equipment. The popular guided tours of the live productions that take place three times a day – at 10 a.m., 1 p.m. and 3 p.m. – will inform the visitors in compressed form about the current state of the art and should be on the agenda of every trade fair visitor.

We look forward to exciting discussions and some great conversations.

Future Packaging Fertigungslinie und Gemeinschaftsstand
Organised by Fraunhofer IZM
Gustav-Meyer-Allee 25
13355 Berlin
Deutschland

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Our services
»Get in the Ring«

The showcase of European packaging at SMTconnect will always have to withstand comparison with its international competitors. Ubiquitous multimedia networking raises the question of what added value such a trade fair offers. It is not only the B2B and B2C event. It is, above all, the personal contact with manufacturers, technologists, and process owners and the benefit offered by close proximity. During SMTconnect, the most diverse contacts to customers, technicians, and scientists can be maintained or newly established.

The team of the Future Packaging production line and joint stand always tries to have an open ear for the questions and needs of the visitors. Since scientists will also be present, specific questions can generally be answered satisfactorily and directly thanks to the scientists having their own applications to hand, and a master plan for the implementation of the solution can be worked out immediately.

For an efficient overview of developments and trends, we offer three daily guided tours: These are ideally suited as an introduction to the trade fair events.

Nobody can explain everything and solve all the problems encountered in assembly production, but we are very close.

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Our product groups
Functional test
Labels
Label printer
Label application
Laser marking
Barcode solutions
Component preparation equipment
Magazining units
Technology R & D
Battery holders
Depaneling machines (see also 3 manufacturing equipment for components and modules)
Laser depaneling machines
Molding
Template and screen print
Template and screen printers
Soldering pastes
Conformal coating
Conformal coating systems
Vapor phase soldering systems
Solders
Wire bonder
Wire bonding machines
Clamping
Plugging
BGA/SMT reworksystems
Manual / semiautomatic balling systems
Fully automatic balling systems
Machine linking and transport
Storage devices
Storage systems under nitrogen atmosphere
Wafer bumping
Laser cutting
Dam & Fill
Testhouses
AOI Service
AXI Service
Automatic optical inspection (AOI)
Solder paste AOI
Assembly AOI
Assembly test equipment
In-circuit test equipment and programs
Flying probe test equipment
Function test equipment
Automatic X-ray inspection
Transducter test systems
Burn-in systems
Production data acquisition systems
Machine data acquisition systems
Process and quality data mangement
Software