SGS Service SMD-Technik GmbH

PCB design

material

production

The requirements for high-quality PCB
assembly have not changed in principle: The quality of a printed circuit board still begins with a well-thought-out, production-oriented layout, in which the course for assembly and soldering processes is already set. Pad geometries (footprints) and placement of the components are carefully matched to the desired processes. Especially with mixed technologies such as SMD (surface-mounted components), THT (push-through technology) or press-fit technology, it is important to combine the requirements of the different processes.
The quality of the components, their provision in appropriate packaging, eg for machine-compatible automatic assembly, and their usability for the desired production steps are another point on the way to a functional and, above all, durable assembly.

Furthermore, the required manufacturing steps such as tin paste printing, manual or automatic assembly, reflow processes such as convection or vapor phase soldering, wave soldering, manual or selective soldering, or pressing in must be coordinated. Monitoring the processes and maintaining the necessary equipment does the rest.
Visual inspection of individual production steps and the finished product, depending on the number of pieces manually or automatically (AOI) round off the matter, but only an electrical test gives the certainty of function. Well packaged, from an electrostatic and mechanical point of view, ensures that the product remains functional until it reaches its destination.