Aspach
Baden-Württemberg
71522
Germany
ELECTRONICS MANUFACTURING
On a 4,000 m² site, we provide the basis for redefining goals in close cooperation with our customers. SMT, THT, or mixed assembly, even under clean room Terms Security, we do not understand as special requests, but as the needs of your product.
Highest efficiency and flexible production are the requirements of the service provider today. Designed for shift operation, our capacities are available at any time.
SOLDERING
Wave soldering according to the requirements of IPC A 610
Selective soldering for increased requirements under nitrogen atmosphere
vapor phase soldering
Reflow soldering – convection soldering for all areas of SMD technology
Hand soldering of all kinds up to the ESA-ECSS standard (space travel)
PRODUCTION
from work preparation to production planning according to your call-off dates
Assembly of THT assemblies by machine or manually, according to the needs of your product or specific requirements
Assembly of SMD assemblies up to component size Design 03015 metric (009005 inch)
Assembly of printed circuit boards and special shapes
Assembly under clean room conditions
ELECTRONIC MANUFACTURING SERVICES
Rework Service
BGA rework
Reballing
MATERIALS MANAGEMENT AND PROCUREMENT
supplier selection
Component procurement worldwide
warehousing
parts management
CUSTOM MANUFACTURING
assemblage
Selective painting
Coating
cleaning
Casting technology Hot Melt
Sonderbau
EXAM
AOI
functional test
ICT
Flying Probe
Boundary scan
High voltage test
Burn In
Custom tests
PRODUCTION UNDER CLEAN ROOM CONDITIONS
according to class DIN EN ISO 14644-1 / ISO 7 (RR 10,000)
CERTIFICATIONS
ISO 9001
Product audit according to VDA 6.3
Production facilities monitoring TÜV-Süd
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