SET Corporation SA Smart Equipment Technology

About us
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die Bonders/Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

As a supplier of semiconductor equipment dedicated to high precision applications for over 40 years, SET has developed more than 34 different types of equipment. With more than 300 Device Bonders installed worldwide in more than 30 countries, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders.
First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

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Our services
We know the importance of providing efficient technical support to our customers before, during and after installation of our systems.

In order to ensure that our customers receive benefit of both excellent service and access to ongoing technological advances, we maintain teams of experts in locations around the world. By working closely with our customers, these experts also provide a continuous stream of communication from the field to our factory.

This ongoing communication is one of the many reasons why our solutions have such a high degree of flexibility and precision engineered, application-specific features.

Our product groups
LED and Displays
Printing
Bonding
Wafer level packaging
Chip on Board – Assembly
X-ray inspection