All PB Assembly Manufacturer (EMS) in Pirna

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Micro Systems Technologies Management AG

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Products and Services Printed circuit boards PCBs and chip-packaging substrates High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role. Interconnect technology & EMS Low temperature co-fired ceramic LTCC (Low Temperature Co-fired Ceramic) This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or Read more...