All PB Assembly Manufacturer (EMS) in Magdeburg

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TEPROSA-MIDCopter-III-970x545

TEPROSA GmbH

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3D-MID TECHNOLOGY 3D-MID stands for Molded Interconnected Device . The MID technology makes it possible to use three-dimensional plastic parts as circuit carriers for electronic or mechatronic assemblies. In addition to more freedom in design, cost advantages and a higher functional density are possible advantages of this technology over conventional methods. As a full-line supplier, TEPROSA offers you services for Read more...