Our production is equipped with various drilling, milling and laser machines . This ensures flexibility, fast reaction time and highest precision. We mainly process circuit boards, but of course we can handle other materials as well . Our production manager will gladly accept your inquiries. Here you can find more details …Welcome! Impex Leiterplatten GmbH develops and builds measuring machine Read more...
With our modern measuring and analysis devices, we can test each printed circuit board individually. Even special customer requirements can be precisely controlled after production of the printed circuit boards. Upon request, we will create a measurement protocol for your printed circuit board that is built exactly on the instructions of your quality management. For each batch of production, we Read more...
IBL was founded in 1987 and has been working in the soldering sector of electronics since then. IBL recognised the potential of vapour phase technology for assembly and soldering technology at an early stage. They began to develop their own new systems technology for vapour phase soldering during the introduction of SMD- techniques in the manufacture of assemblies. This early Read more...
Pick & Place Dispensing Automation The FRITSCH placeALL® is the platform for flexible and cost-effective assembling of electronic components. Our high-precision and universal dispensing machines offer all features for a professional production. Our flexible and standardized machines complete every task in a cost-effective way. Read more...
Sensors and actuators for people and the environment Fraunhofer EMFT conducts applied research on sensors and actuators for people and the environment. The just over 100 employees at the three locations Munich, Oberpfaffenhofen and Regensburg have many years of experience and extensive know-how in microelectronics and microsystems technology. The technology offerings range from semiconductor processes and MEMS technologies through 3D Read more...
Ultrasonic Laser Bonder Leading connection technology for large conductor cross sections in power electronics. Ultrasonic wire bonders Semi-automatic and fully automated connection solutions for sensors, semiconductors and automotive industry. BPC Inside Patented Bond Control System for monitoring and controlling the quality of the bond in the ongoing process. Bond Academy Best Bonder Results through user training, knowledge transfer, advice and Read more...
The FUJI EUROPE CORPORATION GmbH websites were created with all possible care. Nevertheless, FUJI EUROPE CORPORATION GmbH cannot guarantee that the given information is free from error or inaccuracy. FUJI EUROPE CORPORATION GmbH excludes all liability for losses which may be directly or indirectly the result of using this website, insofar as such losses are not the direct result of Read more...
MBK – this is the EUTECT modular construction kit for optimal connections. He guarantees the perfect solution for every customer product. product flexibility custom economically freely combinable connection technology Modular soldering technique Wire conveyor technology EUTECT software Automation concepts robot Automation complete machines support modules Consulting and development welding technology Read more...
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