THE ADVANTAGES AT A GLANCE
Compound at room temperature
KlettWelding combines two surfaces prepared by NanoWiring at room temperature. The process not only saves the reflow process and protects the semiconductor components, but is also applicable to films.
Compound at room temperature
High electrical and thermal conductivity
The purely metallic compound of, inter alia, copper, gold or nickel, has significantly higher electrical and thermal conductivities, as soldering, bonding, adhesives or screws.
High electrical and thermal conductivity
High long-term stability
The use of unmixed metals in the compound prevents embrittlement of the compound as a result of temperature cycling. Also, no battery voltages occur.
High long-term stability
Enables 3D packaging
In VelcroWelding and Velcro sintering, the bonding process takes place in the z-axis. Two-sided NanoWiring also allows substrates to be stacked. This reduces the area consumption and enables the construction of hybrids.
Enables 3D packaging
No heavy metals
The substitution of gold with copper eliminates the environmentally harmful gold recycling. Also, no heavy metals or rare earths are used for the compound.
No heavy metals
High temperature
After bonding, the contact is resistant to high temperatures up to over 600 ° C. A direct thermal connection without additives is thus possible.
High temperature
