ERS electronic GmbH

GLOBAL LEADER IN THERMAL CHUCK SOLUTIONS
We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

THERMAL CHUCKS
AirCool® Prime,
AC3, AirCool®

More about thermal chucks

DEBONDING SOLUTIONS
Thermal debonding solutions based on our patented AirCool® technology

ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700
The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding…

ERS electronic GmbH at ITWS
Meet us in Freising! May 6 – May 7, 2019 ERS electronic is excited to participate in ITWS11, where ERS electronic GmbH’s CEO &CTO Klemens Reitinger will deliver a presentation on…