Business Category: PB Assembly Manufacturer (EMS)
Chemicals for electronic substrates
Super-roughening type adhesion enhancement
(CZ roughening treatment)Etch downRolled copper roughening treatment
(UT roughening treatment)Various residue removal treatmentsPre-lamination treatment for multilayer substrates
(alternative to black oxide treatment)Degreasing, rust removal, temporary anti-tarnishCopper surface treatment for CO2
laser direct drilling Metal resist stripping Adhesion enhancement for high-frequency substrates HALS Dry film pre treatment Copper seed layer etching Solder
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