HDI circuits (High Density Interconnection)
Do your projects require a high density of interconnections?
Our solution: HDI circuits.
OUR TECHNICAL STRENGTHS
Microvia via-filling
X-ray registration of layers
Insolation by LDI (line at 70 microns)
Micro metallization ratio via ≤ 1
TYPICAL APPLICATIONS
Calculator
CPU board
Use of fine pitch components
PRECAUTIONS TO BE TAKEN
Compliance with implementation rules
Micro metallization ratio via ≤ 1
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