Dow Electronic Materials

DuPont Electronics & Imaging brings a unique depth and breadth of knowledge, applications and technical expertise, and product portfolio to address customers’ needs for connectivity today and in the future.

Our drive to provide our customers with industry-leading innovation is complimented by large scale, best-in-class manufacturing capability, and a team of scientists with deep materials science expertise to make next generation technology a reality for our customers.

With research centers and manufacturing operations located close to our customers in the U.S., China, Taiwan, Korea, and Japan, we pride ourselves on a customer-centric view to ensure we support our customers’ success.

Build the next thing that changes everything.
Our Electronics & Imaging business gives you access to an innovative set of materials that free your designs to be smaller, more complex and more powerful than you could ever imagine.

Advancing the thick PCB manufacturing process for 5G infrastructure. Thick printed circuit boards (PCBs) over 4 mm thick present both a challenge and an opportunity for the copper plating industry. The opportunity comes in the form of a niche but growing market, with an estimated growth rate of 3-4 percent per year, and a market size of $1 billion for thick PCBs. The primary end application is in communications, with growth of 5G infrastructure set to take off dramatically by 2020. Huawei released the industry’s first 5G slicing router at MWC 2017 in Barcelona in February, and Qualcomm has announced plans to release commercial chips for 5G services in 2018, and competitors are likely to follow suit. This growth, along with opportunities in medical, military, and aerospace applications, will accelerate the demand for thick PCBs.