EAS Agency

We accompany you on the way to the realization of your innovative and sophisticated electronics and sensors as assemblies for devices and systems.

We provide you with customer-specific solutions for a wide variety of applications and different areas of application:

with our targeted technological advice from the early stage of product development
by bringing together relevant service and manufacturing competencies as well as test environments
Support during the entire production process – in the production of sample parts and prototypes as well as in series production.
EAS Agency – teamwork for your project
EAS Agency – teamwork for your project

Specialized in the use of modern methods of assembly and connection technology on various types of wiring carriers, the production of electronic components and sensor elements, assembled circuit board assemblies, electronic modules, hybrid circuits on ceramic substrates as well as special packaging solutions and multi-chip modules can be carried out in different complexity and quantities:

Advice on creating a layout for implementation in thin-film or thick-film technology – including integrated resistors
Production of wiring carriers in thick-film technology and thin-film technology on ceramic substrates Al2O3, AlN and LTCC multilayers
Assembly of SMD and THT components or combinations of SMD / BGA components with COB on circuit boards, foils, ceramics and glasses
Chip-on-board solutions (COB) through precise assembly of unhoused ICs or MMICs enable a higher packing density
Wire bonding with Au or Al thin wire or Al thick wire
Packaging concepts, circuit protection through passivation, glob-top, customer-specific housing, electrical contacting
Test execution for function and resilience.