Cambridge Nanotherm Limited

Metal Clad PCB (MCPCB)
LC
Layer of electricaly isolating alumina (Al2O3) formed on an rigid aluminium base
Ultra-thin layer of adhesive to attach a copper foil circuit trace
Composite thermal conductivity: 120 W/m
Operating temperature: 130 °C
Chip Scale Packaged (CSP) modules
Chip-on-Board LED (COB LED) modules
High density LED modules
Automotive Lighting modules
Horticultural lighting

Thin-Film Substrate
DM
Layer of electricaly isolating alumina (Al2O3) formed on an rigid aluminium base
Direct metallisation on alumina
Composite thermal conductivity: 152 W/m
Operating temperature: 350°C
LED chips packaging substrate
UV LEDs
Chip Scale Packaged (CSP) modules
Chip-on-Board LED (COB LED) modules
High density LED modules
Automotive Lighting modules

Flexible Substrate
FLEX
Layer of electricaly isolating alumina (Al2O3) formed on an flexible aluminium base
Ultra-thin layer of adhesive to attach a copper foil circuit trace on alumina
UV LEDs
Chip Scale Packaged (CSP) modules
Chip-on-Board LED (COB LED) modules
High density LED modules
Automotive Lighting modules
Horticultural lighting
Power semiconductors