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The analyses we offer concern bare and assembled printed circuit boards: PCB lay-up and thermal stress, dielectric materials characterization, solder joints acceptability, organic and inorganic contaminations, Cleanliness, thermal simulations, ageing test for reliability issues.
The Laboratory also provides product/process complete qualification plans combining Cross-section, X-Ray Inspection, Pull & Shear tests, climatic chambers ageing, optical and scanning electron microscopy.
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