Kunshan Xingerda Electronics Co., Ltd.

An Expert for PCB Supply Chain Integration Provider. From PCB design, multiple PCBs production to EMS, one stop solution. Faster and reliable.

PRODUCTS

MULTILAYER

Number of layers4-12L
Technology highlightsheavy copper boards; power / Industrial control / Automotive boards
MaterialsFR4 high , halogen free FR4
Copper weights(finished)18um-210um
Minimum track and gap0.075mm/0.075mm
PCB thicknessMin 0.40mm
Maximum dimensions580mm * 680mm
Surface finishes availableHASL(SnPb), LF HASL(SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill0.20mm

RIGID-FLEX

Number of layers4-10L
Bending performanceBased on the specific design, the bend performance can range from a basic 90° bend to fit to a full dynamic flex with 360°range of motion in the flex tail that will withstand continuous cycles throughout the product life
MaterialsRA copper, THE copper, FR-4
Copper weights(finished)12um, 18um, 36um
Miniumu track and gap0.089mm/0.089mm (@ 18um copper weights)
PCB thickness0.4mm to 1.5mm
PCB thickness in flex section0.08mm to 0.2mm
Maximum dimensions457mm to 610mm
Surface finishes availableENIG, ENEPIG
Minimum mechanical drill0.21mm drilled(0.15mm finished)

FLEXIBLE

Number of layers1-8L
MaterialsPolyimide, Polyester0.1mm-3.0mm
Copper weights(finished)2um – 70um
Miniumu track and gap0.03mm/0.03mm
PCB thicknessMin. 0.05mm
Metal core thickness0.05mm – 0.5mm
Maximum dimensionsMax. width 500mm (NO limitation on length)
Surface finished availableOSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers
Minimum mechanical drill0.10mm
Minimum leaser drill0.025mm

DOUBLE SIDED

Number of layers2L
MaterialsFR4 , Halogen free FR4
copper weights(finished)18um-120um
Miniumu track and gap0.075mm/0.075mm
PCB thicknessMin 0.40mm
Maximum dimensions510mm*680mm
Surface finished available
HASL(SnPb), LF HASL(SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill0.20mm

INSULATED METAL SUBSTRATE BOARD

Number of layers1-2L
MaterialsAluminium & copper plates.
Dielectric thickness0.10mm，0.15mm
Thermal conductivity12 W/m/K
Profile methodPunching, Liquid cooled routing
Copper weights(finished)18um-105um
Miniumu track and gap0.10mm/0.10mm
Metal core thicknessMin 0.40mm
Maximum dimensions550mm*700mm
Surface finished availableHASL, LF-HASL, OSP
Minimum mechanical drill0.50mm

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INSULATED CERAMIC SUBSTRATE BOARD

Number of layers1-2L
Technology highlightsHigh thermal conductivity, High insulation, High dielectric constant
MaterialsAlumina ceramics, Aluminium Nitride Ceramic
Coper weights(finished)18um-300um
Minimum track and gap0.1mm/0.1mm
PCB thickness0.25 – 2mm
Maximum dimensions130mm * 180mm
Surface finishes availableOSP, ENIG, ENEPIG, Immersion Tin, Electrolytic gold
Minimum mechanical drill0.30mm