DISCO leads the industry in dicing, grinding and polishing technologies. Our dicing equipment is comprised of lasers, singulation, semi-automatic, fully automatic, single and dual spindle saws. Materials we work with include silicon, GaAs, low-k, ceramics, glass and others. Grinding equipment consists of semi-automatic, and fully-automatic grinders capable of ultra-thin grinding, while dry polishers and plasma etchers address stress relief and surface preparation.
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