About Us
AmTECH MICROELECTRONICS, INC. was founded in 1993, to provide ADVANCED MANUFACTURING for high complexity next generation products from “Prototype to Production”. Our Silicon Valley facility includes a 2,500 square foot cleanroom with on-site Engineering Process Development and high-quality U.S. Manufacturing.
Full Automation for ADVANCED MICROELECTRONICS with Die-Attach, Flip Chip, Multi-Chip, Gold Ball Wire Bonding, Aluminum Wedge Wire Bonding, Glob Top, Dam & Fill, Underfill, UV dispense and encapsulation.
Full automation for ADVANCED SMT ASSEMBLY with 01005, BTC, BGA, uBGA, CSP and Flip Chip components on PCB, Rigid-Flex, Flex and Ceramic substrates.
