· Quick-Turn Prototyping
· New Product Introduction (NPI)
· Low to Medium volume – High Complexity Boards are our forte
· High Volume Production
· Full Box Build | Cable Harness Assemblies
· Single/ Double Sided SMT
· Single/ Double Sided Through-hole
· BGA, FPGA, Fine Pitch Components
· X-Ray | AOI
· Functional Testing
· Warranty and Repair Services
· Conformal Coating Services – Outsourced to our industry partner
ENGINEERING
Our engineering team has provided thousands of hours of design and manufacturability reviews for our customers. This alone has allowed ESMI to cut our customers manufacturing costs, improve yields and speed up our customer’s time to market within budget.
· Design for Manufacturability (DFM)
· Design for Testability (DFT)
· PCB Layout and Design Services – Outsourced to our industry partner (Altium, Cadence, Mentor, Valor)
· X-Ray Analysis
· Failure Analysis
· MDA/In-Circuit Test (ICT) | Flying Probe | ESS Testing – Outsourced to our industry partner
· Component Selection and Replacement
· Functional Testing Design
