Unimicron Corporation

Features
Suitable for BGA with smaller ball pitch and higher I/O counts
Fine line, micro via and registration technologies capable of 0.3 mm ball pitch, Increase routing density in complicated design
Thin board capabilities, copper filled via and excellent mounting stability and reliability
Lower Dk / Df material enables better signal transmission performance
Low CTE & High Tg material fulfills high reliability demand
Qualified material and surface treatment for Lead-free process
Benefits
World’s largest HDI manufacturer
Over 10 years’ experience in HDI manufacturing
Well experienced manufacturer with good yield
From both China and Taiwan, multiple plants increase production output in short time
Applications
Smartphone, Feature Phone, Tablet, Ultrabook
e-Reader, MP3 Player, GPS, Portable Game Console
DSC, Camcorder, LCD Module