Micro Systems Technologies

Printed circuit boards
PCBs and chip-packaging substrates
High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Interconnect technology & EMS
Low temperature co-fired ceramic
LTCC (Low Temperature Co-fired Ceramic)
This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Interconnect technology & EMS
Advanced assembly
Advanced assembly
State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Interconnect technology & EMS
Semiconductor packaging
Semiconductor packaging
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Semiconductor technology
Primary batteries for active implants
Primary batteries
High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.